Solder Paste

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Product Description

With an aim to be a pioneer in our domain, we are engaged in formulating and supplying Solder Paste. This waste is widely utilized in the manufacture of printed circuit boards that are used for connecting surface mount components to pads on the board. It initially adheres components in place by being sticky and then it is heated for forming a mechanical bond as well as electrical connection. Moreover, the paste can be applied by jet printing or stencil printing. Further, Solder Paste is used in various applications for providing excellent viscosity and flux levels. 

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